1.Precise polishing process
	2.Dicing process
	3.Crystal axis orientating
	4.Assembly ( Optical contact , etc )
	5.Design and producing ( Etalon filter , Waveplate , etc )

Processing materials	Crystals , Glasses , etc
Thickness	>10μm
Thickness tolerance	<+0.05μm / -0.05μm
Parallelism	<0.5 arc second

Phase measuring interferometer	Spectrum analizer
Rapping machine	Polishing machine
Interferometer	Digital measurement machine
Dicing process of Crystal	Dicing machine
Crystal axis orientating	Assembly ( Optical contact, etc )

	Sales Dept： sales@lambdaprecision.co.jp